LinkProTM Data Center Solutions
Build once. Scale fast.
LinkProTM Cabling delivers end-to-end fiber and high‑speed copper connectivity that’s reliable, easy to manage, and built to scale—from enterprise rooms to hyperscale and AI clusters.
Our architectures and products prioritize reliability, manageability, scalability, and flexibility so your network is ready for what’s next.
What we deliver
- Future‑ready fabric for AI & cloud. Designs and materials proven in next‑gen builds—optimized for rapid deployment and high density—so you can scale GPU fabrics and storage at speed.
- Complete fiber & copper portfolios. Pre‑terminated trunks, cassettes, panels, patching, and structured cabling—paired with high‑speed transceivers and DAC/AOC/ACC/AEC interconnects—for fast turns and clean upgrades.
- High‑density fiber management. Compact, front‑access frames and panels that simplify moves/adds/changes while protecting bend radius and reducing errors—ideal for space‑constrained rows.
- Services that accelerate outcomes. Planning, design, migration, testing, and capacity adds backed by delivery experience across enterprise, Mid-Tier Data Center – MTDC, service‑provider, and hyperscale environments.
Solution building blocks
- Optics & interconnects: 25G SFP28, 100G QSFP28, 200/400/800G QSFP‑DD, 400G/800G OSFP and related DAC/AOC/AEC/ACC options for top‑of‑rack, spine, and DCI.
- Structured cabling: Fiber backbones and copper connectivity designed to minimize upgrade costs and streamline moves/adds/changes.
- Pre‑terminated systems: MTP®/MPO trunks, MMC/SN-MT modules, and cassettes that cut install time and improve consistency across racks and rows.
- Density‑optimized panels: All‑front‑access panels and frames with advanced adapter and cable‑management features for safer, faster jumper handling.
High‑Speed Copper Interconnects (ACC & AEC)
Fiber‑like reach. Copper‑class simplicity.
For short‑to‑mid‑reach links inside or across racks, LinkPro delivers active copper options that bridge the gap between passive DAC and costly optics—ideal for dense AI/GPU fabrics, DDC/CLOS architectures, and cloud scale‑outs. Our portfolio spans 100G to 800G today, with a path to 1.6T in OSFP‑XD.
Two options—one goal: faster, cooler, cleaner builds
- ACC (Active Copper Cable): Copper Twinax with an embedded retimer or redriver to extend reach and ease routing versus passive DAC—often with finer gauges for better airflow. Great for short, power‑aware top‑of‑rack and spine links.
- AEC (Active Electrical Cable): Copper Twinax with integrated retimers (and, in some platforms, gearbox/PCS/FEC) for deterministic, low‑BER links over longer copper runs; a practical middle ground between DAC and AOC.
Why teams choose LinkPro ACC/AEC
- Longer copper reach at high speeds. Proven operation up to 112G PAM4 per lane with cable distances commonly 5–7 m depending on application—covering many ToR–server and row‑to‑row jumps without optics.
- Density & thermal wins. Thinner gauges and smaller bundles improve airflow and bend radius versus thick passive DAC—key for AI racks and liquid‑cooled rows.
- Lower power/cost than optics. In DDC/CLOS builds, AECs can deliver substantially lower power and space versus optical links and bulky DACs, enabling higher rack density.
- Roadmap to 800G and 1.6T. Live demos and product lines from leading vendors show 800G ACC/AEC today and 1.6T AEC on OSFP‑XD with DSP retimers—future‑proofing for next‑gen fabrics.
Where it fits
- AI/GPU back‑end networks & DDC/CLOS: Thin, low‑power AECs purpose‑built for dense in‑rack CLOS and GPU cluster back‑end networks.
- ToR ↔ server & leaf ↔ spine: ACC for short, power‑sensitive runs; AEC when you need more reach without jumping to optics.
- PCIe disaggregation inside the rack: Emerging AEC options extend PCIe Gen5/Gen6 copper reach for server/GPU pooling.
What we serve
- Form factors: QSFP, QSFP‑DD, OSFP, OSFP‑XD (1.6T class) in straight and breakout variants.
- Speeds: 100G / 200G / 400G / 800G today; path to 1.6T.
- Cable lengths: Application‑dependent, typically up to ~7 m for AEC; shorter for ACC linear/redriver implementations.
- Signal integrity: Retimer‑based AEC with options like gearbox/PCS/FEC for plug‑and‑play, low‑BER performance.
Why LinkProTM
- Vendor‑agnostic, best‑of‑breed. We integrate Tier‑1 ecosystems with innovative platforms and versatile optics/interconnects to match performance, lead time, and budget.
- Designed for lifecycle simplicity. From day‑1 deployment to day‑2 operations, our layouts favor clean cable management, serviceability, and smooth 100→200→400→800G/1.6T migrations.
Build once. Scale fast.
